Description: Quantifying the Value of RFID and the EPCglobal Architecture Framework in Logistics Please note: this item is printed on demand and will take extra time before it can be dispatched to you (up to 20 working days). Author(s): Dieter Uckelmann Format: Paperback Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG, Germany Imprint: Springer-Verlag Berlin and Heidelberg GmbH & Co. K ISBN-13: 9783642436970, 978-3642436970 Synopsis The "EPCglobal Architecture Framework" is currently the most accepted technical approach to the Internet of Things and provides a solid foundation for building Business-to-Business information networks based on unique identifications of 'things'. Lately, the vision of the Internet of Things has been extended to a more holistic approach that integrates sensors as well as actuators and includes non-business stakeholders. A detailed look at the current state of the art in research concerning cost and benefit estimations is provided and the limits of Cost Benefit Sharing for RFID-based IT-infrastructures are explained. In this work a market driven evaluation based on sales potential of information is developed. Simple technical means for aggregation of micro values to a billable amount are discussed. The requirements for electronic billing infrastructure are defined and a matching e-billing solutions for an evaluation scenario is presented, providing a technical infrastructure to evaluate and bill product-related information in a future Internet of Things, based on an extended EPCglobal Architecture. Further opportunities and threats are discussed to provide an overview of its future potential. As a result it will contribute to the sustainable success of the Internet of Things itself.
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Location: Aldershot
End Time: 2024-12-21T11:48:18.000Z
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Book Title: Quantifying the Value of RFID and the EPCglobal Architecture F...
Number of Pages: 144 Pages
Language: English
Publication Name: Quantifying the Value of Rfid and the Epcglobal Architecture Framework in Logistics
Publisher: Springer-Verlag Berlin AND Heidelberg Gmbh & Co. KG
Publication Year: 2014
Subject: Engineering & Technology, Computer Science, Management, Business
Item Height: 235 mm
Item Weight: 266 g
Type: Textbook
Author: Dieter Uckelmann
Subject Area: Manufacturing Engineering
Item Width: 155 mm
Format: Paperback