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Multi-Chip Module Test Strategies by Yervant Zorian (English) Hardcover Book

Description: Multi-Chip Module Test Strategies by Yervant Zorian This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. FORMAT Hardcover LANGUAGE English CONDITION Brand New Publisher Description Multi-chips modules (MCMs) in the late 1990s consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. This volume of research presents updated test strategies for MCMs. It is designed for engineers interested in practical implementations of MCM test solutions and for designers seeking current test and design-for-testability solutions for their next designs. Table of Contents Fundamentals of MCM Testing and Design-for-Testability.- Die Level Testing.- Known Good Die.- Substrate Testing.- A Survey of Test Techniques for MCM Substrates.- Smart Substrate MCMs.- Electron Beam Probing—A Solution for MCM Test and Failure Analysis.- Module Level Test.- MCM Test Strategy Synthesis from Chip Test and Board Test Approaches.- Designing "Dual Personality" IEEE 1149.1 Compliant Multi-Chip Modules.- An Effective Multi-Chip BIST Scheme.- MCM Test Applications.- Design-for-Test in a Multiple Substrate Multichip Module.- A Test Methodology for High Performance MCMs.- Module Level Diagnosis.- A Formalization of the IEEE 1149.1-1990 Diagnostic Methodology as Applied to Multichip Modules.- Multichip Module Diagnosis by Product-Code Signatures.- Simulation Techniques for MCMs.- Simulation Techniques for the Manufacturing Test of MCMs.- MCM Test Economics.- Economic Analysis of Test Process Flows for Multichip Modules Using Known Good Die. Promotional Springer Book Archives Long Description MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs.Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain.Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2). Details ISBN079239920X Series Frontiers in Electronic Testing Year 1997 ISBN-10 079239920X ISBN-13 9780792399209 Format Hardcover Place of Publication Dordrecht DEWEY 621.381046 Edited by Yervant Zorian Short Title MULTI CHIP MODULE TEST STRATEG Language English Media Book Series Number 7 Publication Date 1997-05-31 Pages 167 Publisher Springer Imprint Springer Country of Publication Netherlands Illustrations 167 p. DOI 10.1007/b117539;10.1007/978-1-4615-6107-1 Author Yervant Zorian Edition Description Reprinted from JOURNAL OF ELECTRONIC TESTING, 10:1-2, 1997 Alternative 9781461377986 Audience Professional & Vocational We've got this At The Nile, if you're looking for it, we've got it. With fast shipping, low prices, friendly service and well over a million items - you're bound to find what you want, at a price you'll love! TheNile_Item_ID:96285931;

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Multi-Chip Module Test Strategies by Yervant Zorian (English) Hardcover Book

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ISBN-13: 9780792399209

Book Title: Multi-Chip Module Test Strategies

Number of Pages: 167 Pages

Language: English

Publication Name: Multi-Chip Module Test Strategies

Publisher: Springer

Publication Year: 1997

Subject: Physics

Item Height: 254 mm

Item Weight: 576 g

Type: Textbook

Author: Yervant Zorian

Subject Area: Electrical Engineering

Item Width: 203 mm

Format: Hardcover

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