Description: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits, Paperback by Lim, Sung Kyu, ISBN 1489986960, ISBN-13 9781489986962, Brand New, Free shipping in the US This book describes a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It provides full details of all key algorithms, for maximum understanding and utility.
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Book Title: Design for High Performance, Low Power, and Reliable 3D Integrate
Number of Pages: Xxviii, 560 Pages
Publication Name: Design for High Performance, Low Power, and Reliable 3d Integrated Circuits
Language: English
Publisher: Springer New York
Subject: Computer Graphics, Systems Architecture / General, Software Development & Engineering / General, Electronics / Circuits / Integrated, Nanotechnology & Mems, Electronics / Circuits / General
Publication Year: 2014
Item Weight: 309.5 Oz
Type: Textbook
Subject Area: Computers, Technology & Engineering
Item Length: 9.3 in
Author: Sung Kyu Lim
Item Width: 6.1 in
Format: Trade Paperback
